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smt生产工艺流程图?1.安装不良其它，今天小编就来说说关于smt生产工艺流程图?下面更多详细答案一起来看看吧!
smt生产工艺流程图
1.安装不良
其它 | Other |
少件 | Missing Component |
多件/残件 | Extra Component on PCBA |
立碑 | Tombstoning |
反向 | Wrong Orientation |
错件 | Wrong Component |
偏位 | Shift/Off Pad |
侧立 | Side Termination |
反白 | Upsidedown |
浮高 | Float |
脚长 | Lead too long |
翘脚 | Lifted Lead |
脚未出 | Lead too short |
未装Bumper | missing Bumper |
螺丝松动 | Loose Screw |
未装螺丝 | Missing Screw |
零件脚偏位 | Part Pin Shift |
折脚 | Bent Lead |
2. 焊 接 不 良
其它 | Other |
少锡 | Insufficient Solder |
空焊 | No Solder |
多锡/包焊 | Excess Solder |
锡桥 | Solder Bridge |
针洞/空洞 | Pinholes/Void |
冷焊 | Cold solder |
堵孔 | Solder in PTH |
锡尖 | Solder Projections |
锡裂 | Fractured Solder |
爬锡 | Wicking |
拒锡 | Dewetting |
3. 清 洁 度
其它 | Other |
锡珠 | Solder Balls |
锡渣 | Solder Splashes |
助焊剂残留物 | Flux Residues |
G/F 沾锡 | Solder on G/F |
PCB 脏污 | Contamination on PCB |
4. P C B
其它 | Other |
断线 | Trace open |
线路短路 | Trace short |
分层 | Delamination |
PAD 翘起 | Lifted PAD |
板翘 | Twist Board |
孔内沾绿油 | Soldermask in PTH |
PAD 沾绿油 | Soldermask on PAD |
Via 孔不通 | Impedance On Via |
PAD 脱落 | PAD Peeling |
PAD 氧化 | PAD Discoloration |
线路有阻抗 | Impedance On Trace |
裸铜 | Bare Copper |
气泡 | Blister |
Via 孔沾锡 | Solder On Via |
白斑 | Measling |
Via 孔沾绿油 | Soldermask On Via |
丝印不良 | Defect Silkscreen |
5. 元 件
其它 | Other |
组件破损 | Component Damaged |
组件功能不良 | Component Fail |
高低 Pin | Uneven Pin |
缺 Pin | Missing Pin |
引脚变色 | Lead Discoloration |
G/F 不良 | G/F defect |
值偏大 | Value High |
值偏小 | Value Low |
歪 Pin | Twisted Pin |
弯 Pin | Bent Pin |
组件变形 | Component Distortion |
不良现象中英文对照表
1.缺件(MISSING PARTS) |
2.错件(WRONG PARTS) |
3.多件(EXCESSIVE PARTS) |
4.短路(SHORT) |
5.断路(OPEN) |
6.线短(WIRE SHORT) |
7.线长(WIRE LONG) |
8.拐线(WIRE POOR DDRESS) |
9.冷焊(COLD SOLDER) |
10.包焊(EXCESS SOLDER) |
11.空焊(MISSING SOLDER) |
12.锡尖(SOLDER ICICLE) |
13.锡渣(SOLDER SPLASH) |
14.锡裂(SODER CRACK) |
15.锡洞(PIN HOLE) |
16.锡球(SOLDER BALL) |
17.锡桥(SOLDER BRIDGE) |
18.滑牙(SCREW LOOSE) |
19.氧化(RUST) |
20.异物(FOREIGNER MATERIAL) |
21.溢胶(EXCESSIVE GLUE) |
22.锡短路(SOLDER BRIDGE) |
23.锡不足(SOLDER INSUFFICIENT) |
24.极性反(WRONG POLARITY) |
25.脚未入(PIN UNSEATED) |
26.脚未出(PIN UNVISIBLE) |
27.脚未剪(PIN NO CUT) |
28.脚未弯(PIN NOT BENT) |
29.缺盖章(MISSING STAMP) |
30.缺标签(MISSING LABEL) |
31.缺序号(MISSING S/N) |
32.序号错(WRONG S/N) |
33.标签错(WRONG LABEL) |
34.标示错(WRONG MARK) |
35.脚太短(PIN SHORT) |
36.J1不洁(J1 DIRTY) |
37.锡凹陷(SOLDER SCOOPED) |
38.线序错(W/L OF WIRE) |
39.未测试(NO TEST) |
40.VR变形(VR DEFORMED) |
41.PCB翘皮(PCB PEELING) |
42.PCB弯曲(PCB TWIST) |
43.零件沾胶(GLUE ON PARTS) |
44.零件脚长(PARTS PIN LONG) |
45.浮件(PARTS LIFT) |
46.零件歪斜(PARTS TILT) |
47.零件相触(PARTS TOUCH) |
48.零件变形(PARTS DEFORMED) |
49.零件损坏(PARTS DAMAGED) |
50.零件脚脏(PIN DIRTY) |
51.零件多装(PARTS EXCESS) |
52.零件沾锡(SOLDER ON PARTS) |
53.零件偏移(PARTS SHIFT) |
54.包装错误(WRONG PACKING) |
56.尺寸错误(DIMENSION WRONG) |
57.二极管坏(DIODE NG) |
58.晶体管坏(TRANSISTOR NG) |
59.振荡器坏(X’TL NG) |
60.管装错误(TUBES WRONG) |
61.阻值错误(IMPEDANCE WRONG) |
62.版本错误(REV WRONG) |
63.电测不良(TEST FAILURE) |
64.版本未标(NON REV LEBEL) |
65.包装损坏(PACKING DAMAGED) |
66.印章模糊(STAMPS DEFECTIVE) |
67.标签歪斜(LABEL TILT) |
68.外箱损坏(CARTON DAMAGED) |
69.点胶不良(POOR GLUE) |
70.IC座氧化(SOCKET RUST) |
71.缺UL标签(MISSING UL LABEL) |
72.线材不良(WIRE FAILURE) |
73.零件脚损坏(PIN DAMAGED) |
74.金手指沾锡(SOLDER ON GOLDEN FINGERS) |
75.包装文件错(RACKING DOC WRONG) |
76.包装数量错(PACKING Q’TY WRONG) |
77.零件未定位(PARTS UNSEATED) |
78.金手指沾胶(GLUE ON GOLDEN FINGERS) |
79.垫片安装不良(WASHER UNSEATED) |
80.线材安装不良(WIRE UNSEATED) |
81. 立碑(TOMBSTONE) |
